A team from Dalian University of Technology has unveiled a tension-driven fluid drawing technique for printing freestanding 3D conductive wires. Using a high-viscosity silver nanoparticle ink, a ...

The process flow for creating Cu-LIG FHEs. Starting from top-left and clockwise to the right: creating a mixture of Pd and SU-8, spin-coating onto a polyimide film and drying, forming LIG from the ...

Boise State University researchers have unveiled a cutting-edge approach to manufacturing flexible hybrid circuits - reducing costs, waste, and environmental impact. Their work leverages the ...

PSAs and carefully chosen connectors can reduce the shock of intense conditions. A reader has a flexible circuit application that experiences significant shock and vibration in service. Are there ...

Flexible three-dimensional integrated circuits (3D ICs) enable high-density interconnects, miniaturization, and multifunctionality. Unlike rigid circuits, flexible 3D ICs can conform to various ...

A printing technology, inspired by the resilience of tree root systems, is set to redefine the future of conformal electronics. This innovation addresses long-standing challenges related to the ...

(Nanowerk News) After thousands of years as a highly valuable commodity, silk continues to surprise. Now it may help usher in a whole new direction for microelectronics and computing. While silk ...